APLICACIONES
- Industria: Flat Panel Display, Chemical Manufacturing, Data Storage, Ink
- Proceso: Wet Etch and Clean, Resist Stripper, HDD Assembly – Cleaning, Cleaning, Chemical Manufacturing
- Química: Dilute Acids, Dilute Bases, Solvents, Photochemicals, Pigments
- Punto Instalación: Point of Tool
ESPECIFICACIONES
Materiales
Membrana, soporte, nucleo, sleeve: Polypropylene / O-ring (AS568-222): EPDM, FKM, E-FKM
Condiciones máximas de trabajo
Maximum forward differential pressure: 0.4 MPa (4.0 bar; 58.02 psi @ 20°C (68°F), 0.1 MPa (1.0 bar; 14.50 psi) @ 80°C (176°F)
Maximum reverse differential pressure: 0.25 MPa (2.5 bar; 36.26 psi @ 20°C (68°F)
Temperatura máxima de trabajo: 80°C (176°F)
Dimensiones (nominal)
Longitud: 261 mm (CD-0, 10″) / Diámetro: 69 mm (CD-0, 10″)