APPLICATIONS
- Industry: Flat Panel Display, Data Storage, Chemical Manufacturing
- Process: Facilities, HDD Assembly – Cleaning, Substrate Cleaning, Magnetic Head – Wet Etch and Clean, HGA/HSA Assembly – Cleaning, Chemical, Cleaning, Rework
- Chemistry: Dilute Acids, Dilute Bases, DI Water
- Installation Point: Point of Tool, Bulk
SPECIFICATIONS
Materials
Membrane: Hydrophilic polyethersulfone
Support, core, sleeve, endcaps: Polypropylene
O-ring: EPDM, FKM, E-FKM
Retention ratings
0.1, 0.2, 0.45, 1.0 µm
Maximum operating conditions
Maximum forward differential pressure: 0.4 MPa (4 bar, 58 psi) @ 20° (68°F), 0.2 MPa (2 bar, 29 PSi) @ 90°C (194°F)
Maximum reverse differential pressure: 0.2 MPa (2.5 bar, 36 psi) @ 20°C (68°F)
Maximum operating temperature: 90°C (194°F)
Dimensions
Length: 260 mm (CD-O, 10″); 251 mm (CD-F, 10″)
Diameter: 70 mm (CD-0/F)